Cadence Sigrity and System Analysis 2023.1 HF003 (23.10.003) Win x64

Free Download Cadence Sigrity and System Analysis 2023.1 HF003 | 12.6 Gb
Owner:Cadence Design Systems
Product Name:Sigrity and Systems Analysis
Version:2023.1 HF003 (23.10.003)
Supported Architectures:x64
Website Home Page :www.cadence.com
Languages Supported:english
System Requirements:Windows *
Size:12.6 Gb
Cadence Design Systems, Inc., a leader in global electronic design innovation, is pleased to announce the availability of Sigrity and Systems Analysis 2023.1 HF003 (23.10.003) is a supplier of software for IC package physical design and for analyzing power integrity and signal integrity.

Sigrity and Systems Analysis 2023.1 Release – Date: 31 May 2023
Here is a list of some of the key updates in the SIGRITY/SYSANLS 2023.1 release: For more details about these and all the other new and enhanced features introduced in this release, refer to the following document: Base_SIG23.10.000_README-Release_Notes.pdf
Celsius Thermal Solver
–Adaptive Thermal Management Using Python API Module:The PCB/PKG Transient Thermal Simulation workflow in the Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) module has introduced a Python Power API module, which allows you to employ adaptive thermal management strategies based on temperature triggers. This feature incorporates thermal mitigation to prevent overheating of devices during heavy workloads.
–Parameter Sweeping Updates:A new Optimality form has been added in the Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) and Celsius Fluid Flow Simulation (Celsius CFD) modules to support parameter sweeping.
–Distributed Computing Setup Updates:The Distributed Computing settings can now be accessed through the Distributed Computing dialog box in the Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) module. Additionally, the Distributed Computing settings for the Server farm now includes a new option called Acquire computer resources at startup that allows the engine to acquire the necessary computer resources in the background before the solver begins.
–Voltus Power Map Import Updates:In the Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) module, when you import a Voltus power map file, in addition to the power density, you can now preview metal density information and add probes to identify areas with high metal density. In addition, if the Voltus power map that you import is a hierarchical power map, you can now view the power information of the Top IP, as well as all the sub-IPs.
–Material Manager Updates:The Material Manager window in the Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) and Celsius Fluid Flow Simulation (Celsius CFD) modules now includes the Import and Export buttons for transferring material properties to a .csv file. Additionally, instead of exporting the material properties to a .csv file, you can directly copy the values to a spreadsheet application.
–Ability to Import Heat Transfer Coefficient Information from a CFD File:The Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) module now offers the ability to import the heat transfer coefficients for terminals defined in the Celsius Fluid Flow Simulation (Celsius CFD) and Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) modules.
Clarity 3D Solver
–Wave Port Support:Support for terminal-based wave ports has been added in Clarity 3D Layout. In Clarity 3D Workbench, the terminal-based wave port feature has been completely enhanced, and support for modal-based wave ports has been added.
–DC-Only Simulation Support:Both ClarityTM 3D Layout and ClarityTM 3D Workbench can now run DC-only simulations. While Clarity 3D Workbench uses the default DC solver from Clarity to perform DC-only simulation, Clarity 3D Layout uses either the default DC solver from Clarity or the PowerDC DC solver to perform DC-only simulation.
–Non-Cylindrical Solder Bump/Balls Support:Clarity 3D Layout has been enhanced to model frustum-shaped solder bump/balls. A new Advanced option has been added on the Solder Ball/Bump direction page of the Port Setup Wizard that enables you to specify the parameters for the frustum-shaped solder bump/balls.
–Circuit (Edge) Ports Support:Clarity 3D Layout has been enhanced to support circuit (edge) ports. Circuit ports are similar to lumped ports and can be used when lumped ports and coaxial ports are obstructed by metal or other nets.
Broadband SPICE
Direct Launch of Broadband SPICE from the Layout Workbench Toolbar:You can directly launch Broadband SPICE from any of the tools that are part of the Layout Workbench by clicking the Launch Broadband SPICE button in the Layout Workbench toolbar.
Celsius PowerDC
–Support for MCP Header and PLOC File in PowerDC:PowerDC now supports the usage of MCP Header and PLOC file. This will help you in extracting the pin information in the design.
–PowerTree Setup in PowerDC Multi-Board Workflows:The PowerTree Setup is now accessible from the Multi-Board/Package IR Drop Analysis and Multi-Board/Package E/T Co-Simulation workflows in PowerDC.
–Simulation Report Enhancements:A significant number of enhancements have been made to the PowerDC simulation reports. Some major enhancements are listed below:
. The Multi-Board simulation reports now have the same format as that of the Single-Board simulation reports.
. The IR-Drop simulation report for the Single-Board and Multi-Board workflows now includes the ambient temperature and conductivity information.
. The Multi-Board simulation report now includes the complete topology for the DC analysis block diagram results.
. The Roughness Upper and Roughness Lower columns have been removed from the Board Stackup table in the simulation report for Single-Board and Multi-Board workflows because the roughness cannot be specified anymore in the PowerDC stackup.
–Tcl Commands to Support Multi-Board Workflow Automation:Several new Tcl commands have been added to support multi-board workflow automation.
SPEEDEM
–High-Performance Computing Options for Improved Simulation:Use the High-Performance Computing (HPC) options in SPEEDEM to improve the simulation speed
–EM-Aware SI Simulation Workflow Added:A new workflow mode, EM-Aware SI Simulation, is added for general-purpose signal integrity simulations while considering the non-ideal power/ground effects.
XcitePI
XcitePI Ported to Dark Theme:In this release, XcitePI has been ported to dark theme, and the appearance of the user interface has been enhanced.
Documentation Enhancement
New Cloud-Based Help System Introduced: Starting with this release, a new cloud-based help system, Doc Assistant, has been introduced. Doc Assistant enables you to access the latest documents available online for all the Cadence products installed on your machine. It has a web application interface through which you can search and view both offline (locally installed) and online (on Cloud) documentation.
To launch Doc Assistant:
On Windows
1. Navigate to the/tools/bin folder.
2. Double-click cda.exe.
On Linux
1. Navigate to the/toolx.lnx86/bin directory.
2. Type ./cda at the command prompt.
Sigrity and Systems Analysis 2023.1 HF2 Release – Date: 26 Oct 2023
Here is a list of some of the key updates in the SIGRITY/SYSANLS 2023.1 HF2 release: For more details about these and all the other new and enhanced features introduced in this release, refer to the following document: Release_Notes.pdf
Celsius Thermal Solver
–Bulk Edit Heat Transfer Conditions:A new Bulk Edit option has been added in the Heat Transfer Coefficient dialog box of the Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) module. You can use this option to edit heat transfer coefficients and temperature values in bulk.
–Support for PWL Waveform File in Sink Current:You can now import current values from a PWL waveform file while specifying a transient current source for a sink in the Celsius Solid Objects Simulation for 3D Structures (Celsius 3D) module. Use the Import PWL button to import historical current values and perform comparative analysis.
–Support for Temperature-Dependent Resistors:The Celsius Solid Objects Simulation for Layered Structures (Celsius 2D) module now supports temperature-dependent resistors via the Temp-Resistance Table column. If you upload a file with temperature-resistance values, it will override the default resistance value.
Clarity 3D Technology
–Inductance Extraction Workflow Introduced:A new inductance extraction workflow that provides a Quasi-Static solver-based Resistance (R), Inductance (L), Capacitance (C), and Conductance (G) extraction (RLCG extraction) has been added in Clarity 3D Layout and Clarity 3D Workbench.
Celsius PowerDC
–Optimizing the Current-Limited IR Drop Analysis:In the Single-Board Current-Limited IR Drop Analysis workflow, the current for all the sinks can be changed to get the worst (largest) case for each sink. To do so, ensure that the checkboxes under the Optimization column in the Voltage Drop Analysis Setup -> Set up Sinks form are selected.
–Temperature-Dependent Resistors:PowerDC now supports temperature-dependent resistors. The resistance of the component varies as a function of the temperature. A new column, Temp-Resistance Table, has been added in the Voltage Drop Analysis Setup -> Set up Discretes form. You can upload a .txt file here having temperature-resistance pairs. If a file is uploaded here, it will replace the default resistance value. This feature is supported only in the single-board workflows.
PowerSI
Remote Simulation: A new Enable Remote Simulation option has been added in the Computer Resources – Setup dialog box. This feature helps in improving the performance and efficiency of the simulation process by distributing the simulation load and saves time.
XtractIM
Presimulation Validation Checks: You can now perform validation checks related to the geometry of the layout design before running the simulation in XtractIM. This helps you detect and resolve any potential errors that could cause the simulation to fail or generate incorrect simulation results.
Celsius EC Solver Introduced
Celsius EC Solver, a proven cooling simulation software that performs fast and accurate analysis of the thermal performance of electronic systems has been introduced in this release. It enables electronic system designers to address the most challenging thermal/electronics cooling management problems quickly and accurately. Celsius EC Solver utilizes a powerful computational engine and meshing technology that enables designers to model and analyze complex designs to not only reduce the risks of product failures but also to optimize thermal solutions to maximize performance.
You can install Celsius EC Solver while installing the SIGRITY/SYSANLS 2023.1 HF2 release.

Cadence Sigrityprovides a rich set of gigabit signal and power network analysis technologies, including a unique power-aware signal integrity analysis capability for system, printed circuit board (PCB), and IC package designs. The combination of Sigrity analysis technologies with Cadence Allegro and OrCAD design tools will provide a comprehensive front-to-back integrated flow to enable system and semiconductor companies to deliver high-performance devices employing gigabit interface protocols such as DDR and PCI Express. The integrated solution will particularly benefit customers delivering electronic systems in high-growth markets such as mobile multimedia devices and cloud computing infrastructure.
Systems Analysisproducts complement Sigrity tools and are focused on complete systems. Thermal, EMI, RF, and extraction simulations include design data beyond ECAD and often include MCAD components such as antennas, cables, connectors and enclosures.
Cadence Sigrity: How to Avoid Power Delivery Problems in your PCBs
Ensure uniform current density in your design and put a stop to the additional time and money spent on troubleshooting hard to find power delivery network issues in the lab with Allegro In-Design Analysis powered by Sigrity.
Cadenceis a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work.